[OpenFOAM] MotherBoard Cooling

Effective cooling is essential for maintaining the performance and reliability of electronic hardware. Key components on a motherboard—such as the CPU, RAM, VRMs, and SSD—generate significant heat that must be managed to prevent overheating and performance degradation.

In this project, a transient conjugate heat transfer (CHT) simulation was carried out using OpenFOAM to study the thermal behavior of a motherboard. The geometry and mesh were prepared in Salome, capturing the main heat-generating components. The simulation provides insight into how OpenFOAM can be used for electronics cooling.

 The simulation settings are as follows :

Turbulence model: k-omega SST

OpenFOAM  solver: chtMultiegionFoam

Solver: PIMPLE

Inlet: Air at 5m/s and 285K 

Heat Condition: Internal heat generation for CPU chip; Heat flux for other components.

Outlet: 0 Pa